Preface
1 Introduction
2 Fundamentals of Chemical Sensing
3 Microtechnology for Chemical Sensors
3.1 Microtechnology Substrate Materials
3.2 Fundamental Semiconductor Processing Steps
3.2.1 Deposition
3.2.2 Patterning
3.2.3 Etching
3.2.4 Doping.
3.3 CMOS Technology
3.4 Microfabrication for Chemical Sensors
3.4.1 Micromachining for Chemical Microsensors
3.4.2 Wafer Bonding
3.4.3 Sensitive-Layer Deposition
4 Microfabricated Chemical Sensors
4.1 Chemomechanical Sensors
4.1.1 Rayleigh SAW Devices
4.1.2 Flexural-Plate-Wave or Lamb-Wave Devices
4.1.3 Resonating Cantilevers
4.2 Thermal Sensors
4.2.1 Catalytic Thermal Sensors （Pellistors）
4.2.2 Thermoelectric or Seebeck-Effect Sensors
4.3 Optical Sensors
4.3.1 Integrated Optics
4.3.2 Microspectrometers
4.3.2.1 Fabry-Perot-Type Structures
4.3.2.2 Grating-Type Structures
4.3.3 Bioluminescent Bioreporter Integrated Circuits （BBIC）
4.3.4 Surface Plasmon Resonance （SPR） Devices
4.4 Electrochemical Sensors
4.4.1 Voltammetric Sensors
4.4.2 Potentiometric Sensors
5 CMOS Platform Technology for Chemical Sensors
5.1 CMOS Capacitive Microsystems
5.1.1 CMOS Capacitive Transducer
5.1.2 On-Chip Circuitry of the Capacitive Microsystem
5.1.3 Capacitive Gas Sensing
5.2 CMOS Calorimetric Device
5.2.1 CMOS Calorimetric Transducer
5.2.2 Calorimeter Circuitry
5.2.3 Calorimetric Gas Sensing
5.3 CMOS Integrated Resonant Cantilever
5.3.1 Resonant Cantilever Transducers
5.3.2 Microcantilever Circuitry
5.3.3 Microcantilevers as Chemical Sensors
5.3.4 Comparison of Cantilevers to Other Mass-Sensitive Devices
5.4 CMOS Microhotplate System Development
5.4.1 CMOS Microhotplates
5.4.2 Hotplate-Based CMOS Monolithic Microsystems
5.5 CMOS Chemical Multisensor Systems
5.5.1 CMOS Multiparameter Biochemical Microsystem
5.5.2 CMOS Gas-Phase Multisensor System
5.6 CMOS Chemical Microsensor and System Packaging
5.6.1 Simple Epoxy-Based Package
5.6.2 Chip-on-Board Package
5.6.3 Flip-Chip Package ，
6 Outlook and Future Developments
References
Abbreviations
Index
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