微纳米加工技术及其应用（英文版）
Preface
About the Author
Chapter 1 Introduction
1.1 Micro-nanotechnologies and micro-nanofabrication technologies...
1.2 Classification ofmicro-nanofabrication technologies
1.3 Organisation of the book
References
Chapter2 Optical Lithography
2.1 Principle of optical lithography
2.2 Process of optical lithography
2.3 Characteristics ofphotoresists
2.3.1 Common features ofphotoresists
2.3.2 Comparison of positive and negative photoresists
2.3.3 Chemically amplified resists
2.3.4 Special photoresists
2.4 Design and fabrication ofphotomasks
2.5 Resolution enhancement techniques
2.5.1 Off-axis illumination
2.5.2 Spatial filtering
2.5.3 Phase shift masks
2.5.4 Optical proximity correction
2.6 The limit of optical lithography
2.7 Optical lithography of thick photoresists
2.7.1 Conventional thick photoresist
2.7.2 SU-8 photoresist
2.8 Grey-scale photolithography
2.9 Computer simulation of optical lithography
2.9.1 Theory of partial coherent imaging
2.9.2 Computer simulation software COMPARE
2.9.3 Comparing the quality of optical lithography
References
Chapter 3 Electron Beam Lithography
3.1 Principle of electron optics
3.2 Electron beam lithography systems
3.2.1 Vector scan and raster scan systems
3.2.2 Shaped beam systems
3.2.3 Projection lithography systems
3.2.4 Microcolumn e-beam lithography systems
3.3 Pattern design and data format for e-beam lithography
3.3.1 Issues in pattern design
3.3.2 Intermediate data format
3.3.3 AutoCAD format
3.3.4 Machine data format
3.4 Electron beam resists and processes
3.4.1 High resolution e-beam resists
3.4.2 Chemically amplified resists
3.4.3 Multilayer resists process
3.5 Electron scattering and proximity effect
3.5.1 Electron scattering in solid materials
3.5.2 Proximity effect in e-beam lithography
3.5.3 Approximation of point spread function
3.6 Correction of proximity effect
3.7 Computer simulation of e-beam lithography
3.8 Ultimate resolution of e-beam lithography
3.8.1 E-beam lithography system
3.8.2 Secondary electron scattering effect
3.8.3 Resist process
References
Chapter 4 Focused Ion Beam Technology
4.1 Liquid metal ion sources
4.2 Focused ion beam systems
4.3 Ion scattering in solid materials
4.4 Principle of focused ion beam processing
4.4.1 Ion sputtering
4.4.2 Ion beam assisted deposition
4.5 Applications of FIB technology
4.5.1 Inspecting and editing integrated circuits
4.5.2 Repairing defects of optical masks
4.5.3 Preparing TEM samples
4.5.4 A versatile microfabrication tool
4.6 Focused ion beam lithography
4.7 Focused ion beam implantation
References
Chapter 5 X-ray Lithography
5.1 Principle of X-ray lithography
5.2 X-ray lithography system
5.2.1 X-ray source
5.2.2 X-ray maskaligner and stepper
5.2.3 X-ray mask
5.2.4 X-ray resists
5.3 High resolution X-ray lithography
5.4 High aspect ration X-ray lithography （LIGA technology） ..
5.4.1 X-ray source
5.4.2 LIGA mask
5.4.3 Thick resists and processes for LIGA
5.4.4 Accuracy of LIGA patterning
References
Chapter 6 Etching Technology
6.1 Wet chemical etching
6.1.1 Anisotropic wet etching of silicon
6.1.2 Isotropic etching of silicon
6.1.3 Isotropic etching of silicon dioxide
6.2 Dry etching 1: reactive ion etching
6.3 Dry etching 2: deep reactive ion etching
6.4 Dry etching 3: ion sputtering etching
6.5 Dry etching 4: reactive gas etching
6.6 Dry etching 5: other physical etching techniques
6.6.1 Laser micromachining
6.6.2 Electrodischarge micromachining
6.6.3 Powder blasting
References
Chapter 7 Replication Technology
7.1 Nanoimprint lithography
7.2 Step and flash nanoimprinting lithography
7.3 Soft lithography
7.4 Micromoulding of plastics
7.4.1 Hot embossing
7.4.2 Microinjection moulding
7.4.3 Casting
7.5 Microstereolithography
7.6 Other replication techniques
7.6.1 DipPen nanolithography
7.6.2 Nanosphere lithography
7.6.3 Nanostencil lithography
References
Chapter 8 Applications of Micro-nanofabrication
Technologies
8.1 Very large scale integrated circuits
8.2 Nanoelectronics
8.3 Optoelectronics
8.4 High density magnetic storage
8.5 Micro-electro-mechanical systems
8.6 Biochips
8.7 Nanotechnology
References
Index
About the Author
Chapter 1 Introduction
1.1 Micro-nanotechnologies and micro-nanofabrication technologies...
1.2 Classification ofmicro-nanofabrication technologies
1.3 Organisation of the book
References
Chapter2 Optical Lithography
2.1 Principle of optical lithography
2.2 Process of optical lithography
2.3 Characteristics ofphotoresists
2.3.1 Common features ofphotoresists
2.3.2 Comparison of positive and negative photoresists
2.3.3 Chemically amplified resists
2.3.4 Special photoresists
2.4 Design and fabrication ofphotomasks
2.5 Resolution enhancement techniques
2.5.1 Off-axis illumination
2.5.2 Spatial filtering
2.5.3 Phase shift masks
2.5.4 Optical proximity correction
2.6 The limit of optical lithography
2.7 Optical lithography of thick photoresists
2.7.1 Conventional thick photoresist
2.7.2 SU-8 photoresist
2.8 Grey-scale photolithography
2.9 Computer simulation of optical lithography
2.9.1 Theory of partial coherent imaging
2.9.2 Computer simulation software COMPARE
2.9.3 Comparing the quality of optical lithography
References
Chapter 3 Electron Beam Lithography
3.1 Principle of electron optics
3.2 Electron beam lithography systems
3.2.1 Vector scan and raster scan systems
3.2.2 Shaped beam systems
3.2.3 Projection lithography systems
3.2.4 Microcolumn e-beam lithography systems
3.3 Pattern design and data format for e-beam lithography
3.3.1 Issues in pattern design
3.3.2 Intermediate data format
3.3.3 AutoCAD format
3.3.4 Machine data format
3.4 Electron beam resists and processes
3.4.1 High resolution e-beam resists
3.4.2 Chemically amplified resists
3.4.3 Multilayer resists process
3.5 Electron scattering and proximity effect
3.5.1 Electron scattering in solid materials
3.5.2 Proximity effect in e-beam lithography
3.5.3 Approximation of point spread function
3.6 Correction of proximity effect
3.7 Computer simulation of e-beam lithography
3.8 Ultimate resolution of e-beam lithography
3.8.1 E-beam lithography system
3.8.2 Secondary electron scattering effect
3.8.3 Resist process
References
Chapter 4 Focused Ion Beam Technology
4.1 Liquid metal ion sources
4.2 Focused ion beam systems
4.3 Ion scattering in solid materials
4.4 Principle of focused ion beam processing
4.4.1 Ion sputtering
4.4.2 Ion beam assisted deposition
4.5 Applications of FIB technology
4.5.1 Inspecting and editing integrated circuits
4.5.2 Repairing defects of optical masks
4.5.3 Preparing TEM samples
4.5.4 A versatile microfabrication tool
4.6 Focused ion beam lithography
4.7 Focused ion beam implantation
References
Chapter 5 X-ray Lithography
5.1 Principle of X-ray lithography
5.2 X-ray lithography system
5.2.1 X-ray source
5.2.2 X-ray maskaligner and stepper
5.2.3 X-ray mask
5.2.4 X-ray resists
5.3 High resolution X-ray lithography
5.4 High aspect ration X-ray lithography （LIGA technology） ..
5.4.1 X-ray source
5.4.2 LIGA mask
5.4.3 Thick resists and processes for LIGA
5.4.4 Accuracy of LIGA patterning
References
Chapter 6 Etching Technology
6.1 Wet chemical etching
6.1.1 Anisotropic wet etching of silicon
6.1.2 Isotropic etching of silicon
6.1.3 Isotropic etching of silicon dioxide
6.2 Dry etching 1: reactive ion etching
6.3 Dry etching 2: deep reactive ion etching
6.4 Dry etching 3: ion sputtering etching
6.5 Dry etching 4: reactive gas etching
6.6 Dry etching 5: other physical etching techniques
6.6.1 Laser micromachining
6.6.2 Electrodischarge micromachining
6.6.3 Powder blasting
References
Chapter 7 Replication Technology
7.1 Nanoimprint lithography
7.2 Step and flash nanoimprinting lithography
7.3 Soft lithography
7.4 Micromoulding of plastics
7.4.1 Hot embossing
7.4.2 Microinjection moulding
7.4.3 Casting
7.5 Microstereolithography
7.6 Other replication techniques
7.6.1 DipPen nanolithography
7.6.2 Nanosphere lithography
7.6.3 Nanostencil lithography
References
Chapter 8 Applications of Micro-nanofabrication
Technologies
8.1 Very large scale integrated circuits
8.2 Nanoelectronics
8.3 Optoelectronics
8.4 High density magnetic storage
8.5 Micro-electro-mechanical systems
8.6 Biochips
8.7 Nanotechnology
References
Index
Dr. Zheng Cui graduated in 1981 from Southeast University in Nanjing, P.R. China, with a Bachelor degree and subsequently obtained a Master degree in 1984 and a Ph.D. degree in 1988 in electronic engineering at the same university. In 1989 he was invited as a visiting research fellowto the Microelectronics Research Centre, Cavendish Laboratory of Cambridge University in the UK, sponsored by the UK Science and Engineering Research Council （SERC）. In 1993 he joined the Central Microstructure Facility, Rutherford Appleton Laboratory of UK （UKs largest national laboratory）, as a Senior Scientist. In 1999 he became a Principal Scientist and a group leader. Dr. Zheng Cuis main areas of expertise and interests are in micro and nanofabrication technologies, including various fabrication technologies for both VLSI manufacturing and MEMS development. In the past 16 years he has participated in 7 European joint research projects, acting as coordinator for two of the projects. He was also the principal investigator and co-investigator of a number of UK national projects and the project leader of two UK Royal Society funded projects. He has authored and co-authored over 130 technical publications, is a programme com-mittee member of the annual International Symposium on Design, Test, Integra-tion and Packaging of MEMS/MOEMS, an associate editor for the Journal of Mi-crolithography, Microfabrication and Microsystems （jM3）, a member of referee panel on nanotechnology for the European Community Framework 6 research programme, and a Fellow of the UK Institution of Electrical Engineers （IEE）. Since 1994, he has been awarded 4 times of the K.C. Wong Scientific Research grants, has won 2 Royal Society UK-China Joint research grants. He has been in-vited as a guest professor in a number of research institutes and universities in China. In 2002, he was selected as an Overseas Assessor for the Chinese Academy of Sciences, and in 2004 he was awarded the Overseas Prominent Scholar fund by the Chinese Academy of Sciences.
《微纳米加工技术及其应用》集作者多年来的实践经验与研究成果，系统地介绍了微纳米加工技术的基础，包括光学曝光技术、电子束曝光技术、聚焦离子束加工技术、X射线曝光技术、各种刻蚀技术和微纳米尺度的复制技术。对各种加工技术着重讲清原理，列举基本的工艺步骤，说明各种工艺条件的由来，并注意给出典型工艺参数。充分分析了各种技术的优缺点及在应用过程中的注意事项。《微纳米加工技术及其应用》强调实用，避免烦琐的数学分析，既注重基础知识又兼顾微纳米加工领域近年来的最新进展及在各高科技领域的应用，并列举了相关参考文献供进一步深入研究，因此不论是对初次涉足这一领域的大专院校的本科生或研究生，还是对已经有一定工作经验的专业科技人员，都具有很好的参考价值。
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